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At the third annual Women in Packaging (WIP) event, held at Pack Expo Chicago 2024, the event brought together a record number of women from across various fields within the packaging industry.

This year, within the context of the world's most important packaging event, interpack, the spotlight was focused on Women in Packaging, a panel discussion featuring five industry female leaders. An audience of more than 150 people attended the panel on 8 May, demonstrating that this is a hot topic that will continue to be discussed even after the Düsseldorf trade fair has concluded.

Building on the success of the first “Women in Packaging - Meet and Greet” event at Pack Expo in Chicago, Robopac USA hosted 10 women from diverse backgrounds at its 2nd “Women in Packaging Seminar”.